Laser Printed Electronics (LPE)
 | Home |
| Description of LPE Process |
The new LPE process uses a laser printing process to deposit conductive or dielectric powders and then fuse the layers by using IR radiation from a laser or IR radiant heat source. This route offers the potential to generate tracks with high mechanical integrity and excellent electrical conductivity (close to bulk metal) without prolonged exposure of the substrate to elevated temperatures. In addition to depositing the conductive tracks the LPE process could be used to deposit layers of dielectric or protective materials, solder for connection of devices and also print legends on boards. In this way the new process provides a “one stop” solution for the production of PCBs.
TP number: TP11/HVM/6/I/AB280K