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Standard Technical Capability for Plated Through Hole PCB |
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Maximum Board Size |
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530 mm by 395 mm (21" by 15.5") |
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Material |
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Epoxy woven glass to BS4584 and UL approval |
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Thickness: |
0.78mm - 3.2mm (0.031" - 0.125") |
Copper Thickness : |
18 -70 microns |
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Minimum Parameters |
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Track Width: |
8 Thou |
Track Spacing: |
8 Thou |
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Minimum Plated Hole Size |
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0.35mm (1..6mm material finished ) |
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Finishes |
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Rohs Lead Free Hot air level |
Rohs compliant Tin/copper SN100C patented solder |
Nickel/Gold |
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Immersion Silver |
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Plating |
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Minimum average plating: |
20 microns |
Minimum average tin lead: |
8 - 12 microns |
Nickel plate: |
5 - 7 microns |
Gold on nickel: |
2.5 microns |
Gold on copper: |
2.5 - 5 microns |
Hot air solder level |
(smobc) |
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Solder resist |
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Two Part epoxy thermal cured |
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Single part thermal cured |
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Photo imageable |
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Component Identification |
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One part thermal cured |
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Two part epoxy thermal cured |
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Tolerance |
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Drilling positional accuracy: |
+/- 0.01mm (0.0004") |
CNC routing tolerance: |
+/- 0.05mm (0.0020") |
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Bare Board Testing |
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Full facilities available |
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For other non-standard requirements, please contact our sales office |
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Quartz
Technical Services Ltd, Stokes Industrial Park, Merrylees, Nr Desford, Leicestershire,
LE9 9FE, United Kingdom.
Telephone 01455-824646 Fax 01455-824819 Email sales@quartz-tsl.com or sales@quartz-tsl.demon.co.uk
, website designed by Mo Designs 0802-603-473
